SMT Process Lead Engineer

About Pinnacle Staffing Group

Pinnacle Staffing Group works hard to connect top talent with great companies. We truly care about you and your success, and it shows in everything we do. Our service separates us from other staffing firms and has landed us on the Inc. 5000 fastest growing companies list. We currently connect people in the Kansas City, Topeka, Wichita, Des Moines, Denver, Omaha, Dallas-Fort Worth, Phoenix, Tucson and Orlando markets

Pinnacle Staffing is looking to fill an immediate opening Direct Hire role for an SMT Lead Processor position for our client located in Melbourne, FL 32904.

• Job Title: SMT Process Lead Engineer
• Location: Melbourne
• Salary: $70,000-$80,000
• Schedule: Monday - Friday 8-5
• Type: Direct Hire

Summary:

 The SMT Process Lead Engineer plays a crucial role in the programming, setup, and operation of Surface Mount Technology (SMT) production lines. This role ensures the efficient and high-quality production of printed circuit board assemblies (PCBAs) by identifying areas for process improvement, implementing Lean practices, maintaining equipment, monitoring production performance, and troubleshooting technical issues. The position involves direct collaboration with Engineering on the design and development of new products, as well as the maintenance of existing products.

Job Description

Essential Duties and Responsibilities:

• SMT Production Oversight:
  • Program, set up, and operate SMT production lines.
  • Ensure the efficient and high-quality production of PCBAs.
  • Identify and implement process improvements using Lean practices.
  • Maintain and repair equipment as needed.
  • Monitor production performance and troubleshoot technical issues.
• Collaboration and Design Verification:
  • Work directly with Engineering on the design and development of new products and maintenance of current products.
  • Import and check ODB+ files to ensure design accuracy.
  • Conduct Design for Assembly (DFA) and Design for Manufacturing (DFM) checks.
  • Verify PCB panel/array designs and ensure proper stencil application for SMT builds.
  • Collaborate on component footprint design and stencil geometry requirements for SMT.
• Technical Expertise:
  • Manage reflow profiles and select appropriate solder types, solder balls, and manufacturers.
  • Handle high pin count designs and BGA packages (.3mm, .4mm, .5mm).
  • Address highly dense PCB designs, focusing on minimum component spacing.
  • Determine and manage panel/array sizes for SMT processes.
  • Understand and apply different stencil thicknesses and coatings.
  • Set up, program, and optimize Automated Optical Inspection (AOI) systems.

Qualifications/Requirements:

• At least 5 years of experience in SMT processes and PCB assembly.
• Proficiency in ODB+ file import and checking.
• Strong understanding of DFA, DFM, and PCB design verification.
• Knowledge of reflow profiles, solder types, and BGA packages.
• Experience with high-density designs and SMT panel constraints.
• Familiarity with stencil thicknesses and coatings.
• Competence in AOI setup and programming.

Physical Demands:

• Frequently lift or move items weighing over 50 pounds.
• Specific vision abilities required include close vision, distance vision, color vision, peripheral vision, depth perception, and the ability to adjust focus.
• Handle test equipment, tools, parts, and manipulate keyboards.
• Stand and walk for extended periods.

EOE: Pinnacle provides equal employment opportunities to all employees and applicants for employment and prohibits discrimination and harassment of any type without regard to race, color, religion, age, sex, national origin, disability status, genetics, protected veteran status, sexual orientation, gender identity or expression, or any other characteristic protected by federal, state or local laws.